Power, Cordless, Air & Automotive Tools

Samsung Tv repair question?

I have a Samsung LNT4665FX with screen problems. I have replaced two caps on the PSB and got the tv to turn on. Now the screen will have lines in it, and then go dark. green blob in corner migrates towards center sometimes. The backlight is still illuminated though when screen goes dark. I tried to reflow solder on the main BGA chip on the main Audio/ video driver board. No luck. Replaced the main Audio/ Video board with a new one. Still no luck. Could it be the LCD controller board? I don’t know what else would cause this? What should I be looking at now, knowing the power supply board is ok and the main audio/ video board is ok? I don’t suspect the screen, but, you never know…
Thanks

Sounds like you are very good at repairs and probably have already tried, but many people open the back of the tv and reseat all the cables attaching everything inside the tv, especially the large main plug into the panel, and that sometimes it fixes the tv.

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Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies $97.95 Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process eng...

Area Array Packaging Handbook : Manufacturing and Assembly $131.00 *Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)*Details the pros and cons of each technology with varying applications*Examines packaging ramifications of high density interconnects (HDI) ...

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Solder Joint Technology $159 Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

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